Invention Grant
- Patent Title: Pressure-sensitive adhesive composition
- Patent Title (中): 压敏粘合剂组合物
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Application No.: US848186Application Date: 1986-04-04
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Publication No.: US4699938APublication Date: 1987-10-13
- Inventor: Yoshihiro Minamizaki , Yoshio Miki , Takayuki Yamamoto , Akira Iio , Toshinori Sakagami
- Applicant: Yoshihiro Minamizaki , Yoshio Miki , Takayuki Yamamoto , Akira Iio , Toshinori Sakagami
- Applicant Address: JPX Osaka JPX Tokyo
- Assignee: Nitto Electric Industrial Co., Ltd.,Japan Synthetic Rubber Co., Ltd.
- Current Assignee: Nitto Electric Industrial Co., Ltd.,Japan Synthetic Rubber Co., Ltd.
- Current Assignee Address: JPX Osaka JPX Tokyo
- Priority: JPX60-73016 19850405
- Main IPC: C08F297/00
- IPC: C08F297/00 ; C08F297/02 ; C08F297/04 ; C09J7/02 ; C09J153/00 ; C09J153/02 ; C08L53/02
Abstract:
A pressure-sensitive adhesive composition comprising as a base polymer a mixed block copolymer comprising a polymer block of a monovinyl-substituted aromatic compound and a polymer block of a conjugated diene compound. The pressure-sensitive adhesive composition is useful to seal, for example, corrugated board or carton.
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