发明授权
- 专利标题: Substrate for printed circuit
- 专利标题(中): 印刷电路基板
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申请号: US840149申请日: 1986-03-17
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公开(公告)号: US4707565A公开(公告)日: 1987-11-17
- 发明人: Shin Kasai , Hideharu Waketa , Keiichi Kato , Yutaka Kawaguchi
- 申请人: Shin Kasai , Hideharu Waketa , Keiichi Kato , Yutaka Kawaguchi
- 申请人地址: JPX
- 专利权人: Nitto Boseki Co., Ltd.
- 当前专利权人: Nitto Boseki Co., Ltd.
- 当前专利权人地址: JPX
- 优先权: JPX60-55550 19850319; JPX60-244444 19851031
- 主分类号: H05K3/46
- IPC分类号: H05K3/46 ; H05K1/03 ; H05K1/00
摘要:
In a substrate of a printed circuit, a metal foil is mounted onto at least one of the outermost surfaces of a laminate made of a plurality of glass fiber woven fabrics impregnated with synthetic resin, and heated and pressed. Warps and wefts of the glass fiber fabrics filamentated their filaments. The synthetic resin enters gaps among the opening filaments so that the vertically laminated glass fiber fabrics including the opening fibers are integrally jointed with each other. Warps and wefts of the glass fiber fabrics may have their surfaces made fuzzy so that the synthetic resin enters fuzzy filaments. Furthermore, the thus produced substrate may be used as a multilayer printed circuit substrate.
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