A process for the fabrication of seamless substrates which comprises (1) providing a substrate with a release coating composition thereover; (2) depositing thereon by electrostatic powder spraying a polymer; (3) melting the polymer blend; and (4) subsequently permitting the melted blend to cool. Thereafter, layered photoconductive imaging members can be prepared by the application, for example, of a ground plane, a photogenerating layer, and a charge transport layer.