发明授权
US4734482A Polyimide from ether diamine having the indane structure and
high-temperature adhesive of polyimide
失效
具有二聚氰胺结构的乙二胺的聚酰亚胺和聚酰亚胺的高温粘合剂
- 专利标题： Polyimide from ether diamine having the indane structure and high-temperature adhesive of polyimide
- 专利标题（中）： 具有二聚氰胺结构的乙二胺的聚酰亚胺和聚酰亚胺的高温粘合剂
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申请号： US945477申请日： 1986-12-23
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公开(公告)号： US4734482A公开(公告)日： 1988-03-29
- 发明人: Shoji Tamai , Saburo Kawashima , Yoshiho Sonobe , Masahiro Ohta , Hideaki Oikawa , Akihiro Yamaguchi
- 申请人： Shoji Tamai , Saburo Kawashima , Yoshiho Sonobe , Masahiro Ohta , Hideaki Oikawa , Akihiro Yamaguchi
- 申请人地址： JPX Tokyo
- 专利权人： Mitsui Toatsu Chemicals, Inc.
- 当前专利权人： Mitsui Toatsu Chemicals, Inc.
- 当前专利权人地址： JPX Tokyo
- 主分类号： C08G73/00
- IPC分类号： C08G73/00 ; C08G73/10 ; C09J179/08 ; C08G63/02 ; B32B3/00
摘要：
This invention relates to a novel polyimide and describes the method of its preparation, adhesives of the polyimide and the method for their application.The polyimide has recurring units of the formula ##STR1## (where Y is ##STR2## and R is a tetra-valent radical selected from the group consisting of aliphatic radicals having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).
公开/授权文献
- US5434524A Method of clocking integrated circuit chips 公开/授权日：1995-07-18
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