Invention Grant
- Patent Title: Method and system for multi-layer printed circuit board pre-drill processing
- Patent Title (中): 多层印刷电路板预钻加工方法与系统
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Application No.: US916779Application Date: 1986-10-09
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Publication No.: US4790694APublication Date: 1988-12-13
- Inventor: John W. Wilent , Robert F. Benson , Robert A. Sparks
- Applicant: John W. Wilent , Robert F. Benson , Robert A. Sparks
- Applicant Address: CA Campbell
- Assignee: Loma Park Associates
- Current Assignee: Loma Park Associates
- Current Assignee Address: CA Campbell
- Main IPC: B23B49/00
- IPC: B23B49/00 ; H05K3/00 ; H05K3/46 ; B23C3/00
Abstract:
A method and apparatus for optimizing the drilling position of a multi-layer printed circuit board prior to drilling. A template having precisely located target holes and fixture reference marks provides initial coordinate reference information for multi-layer printed circuit boards to be inspected by x radiation. Each board is processed by insertion into a holding fixture, examination of four quadrant target areas using x-ray sources and detectors, digitization of the target area images in each quadrant, and computaton of the optimum board position in a follow-on drilling apparatus. After optimization, three reference holes are punched along one edge of the board to provide accurate fiducial positioning marks when the board is placed in the drilling apparatus.
Public/Granted literature
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