发明授权
- 专利标题： Method for the replacement of semiconductor devices
- 专利标题（中）： 半导体器件更换方法
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申请号： US922322申请日： 1986-10-23
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公开(公告)号： US4806503A公开(公告)日： 1989-02-21
- 发明人: Hirokazu Yoshida , Hiroshi Nakatani , Keiji Yamamura
- 申请人： Hirokazu Yoshida , Hiroshi Nakatani , Keiji Yamamura
- 申请人地址： JPX Osaka
- 专利权人： Sharp Kabushiki Kaisha
- 当前专利权人： Sharp Kabushiki Kaisha
- 当前专利权人地址： JPX Osaka
- 优先权： JPX60-239695 19851025
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H05K1/11 ; H05K3/22
摘要：
A method for the replacement of semiconductor devices in a multi-chip module that is constructed by mounting semiconductor devices on a tape carrier used as an electrical wiring substrate, wherein when at least one of said semiconductor devices develops a flaw, it is cut away at the finger sections that connect said defective semiconductor device to the tape, and then a different and non-defective semiconductor device having finger sections longer than those of said defective semiconductor device that has been removed is connected to said tape in such a manner that the finger sections of said different and non-defective semiconductor device are joined and connected to the corresponding finger sections retained on said tape.
公开/授权文献
- USD353574S Ladder rack support 公开/授权日：1994-12-20
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