Invention Grant
US4809641A Baskets for the handling of semiconductor components 失效
用于处理半导体元件的篮子

Baskets for the handling of semiconductor components
Abstract:
The basket is first moulded such that at the extremities of the lower parts 16 of the side walls 12 are provided supplementary volumes 36 into which the injection points 24 of the plastic material open. After moulding, the supplementary volume 36 are removed by cutting along a plane P in order to obtain the final article of the required size. The invention eliminates from the final article the injection traces and zones which contain internal tensions which can in turn cause cracks.
Public/Granted literature
Information query
Patent Agency Ranking
0/0