Invention Grant
- Patent Title: Baskets for the handling of semiconductor components
- Patent Title (中): 用于处理半导体元件的篮子
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Application No.: US937488Application Date: 1986-12-03
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Publication No.: US4809641APublication Date: 1989-03-07
- Inventor: Bernard Plissonnier
- Applicant: Bernard Plissonnier
- Applicant Address: FRX
- Assignee: Compagnie Plastic Omnium
- Current Assignee: Compagnie Plastic Omnium
- Current Assignee Address: FRX
- Priority: FRX8517925 19851204
- Main IPC: B29C45/00
- IPC: B29C45/00 ; H01L21/673 ; B05C13/02
Abstract:
The basket is first moulded such that at the extremities of the lower parts 16 of the side walls 12 are provided supplementary volumes 36 into which the injection points 24 of the plastic material open. After moulding, the supplementary volume 36 are removed by cutting along a plane P in order to obtain the final article of the required size. The invention eliminates from the final article the injection traces and zones which contain internal tensions which can in turn cause cracks.
Public/Granted literature
- US6111008A Tire with silica reinforced tread which contains specified carbon black Public/Granted day:2000-08-29
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