An easily assembled connecting block provides interconnection between modular plugs and insulated telephone wires or the like. The connecting block includes: (i) a metallic lead frame comprising a number of flat elongated conductive elements that terminate in closely spaced flat wires at one end thereof, (ii) an equal number of metallic connectors that electrically couple to the conductive elements of the lead frame and further provide at least two pairs of opposing contact fingers for insulation displacement; and (iii) a dielectric block for receiving the closely spaced wires within a jack housing contained therein and for supporting the metallic lead frame. In one embodiment the connectors are an integral part of the lead frame itself and are "sandwiched" between a pair of dielectric blocks, each block having a plurality of corresponding slots for guiding wires into the region between opposing contact fingers of the connectors.