Invention Grant
- Patent Title: Method of making a packaged IC chip
- Patent Title (中): 制造封装IC芯片的方法
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Application No.: US203529Application Date: 1988-05-23
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Publication No.: US4820658APublication Date: 1989-04-11
- Inventor: Thomas G. Gilder, Jr. , Raymond D. O'Dean
- Applicant: Thomas G. Gilder, Jr. , Raymond D. O'Dean
- Applicant Address: CT Stamford
- Assignee: GTE Products Corporation
- Current Assignee: GTE Products Corporation
- Current Assignee Address: CT Stamford
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/66
Abstract:
A lead frame for use with an integrated circuit chip comprises a plurality of lead frame segments, each segment comprising a plurality of leads the inner ends of which converge towards a pad area for the chip encircled by the segments.
Public/Granted literature
- US4363605A Apparatus for generating an electrical signal which is proportional to the tension in a bridle Public/Granted day:1982-12-14
Information query
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