To manufacture an electronic component of the present invention and according to a method of manufacturing the electronic component also of the invention, steps of positioning and temporarily fixing the electronic component element are performed by the use of a bent portion formed on the lead wire, the bent portion of the lead wire being pressed into the through hole of the electronic component element. Thereafter, the bonding agent, which was applied to the bent portion, is filled into the through hole of the electronic component element by capillarity. Alternatively, the bonding agent may be injected into the through hole after the lead wire is inserted. Thus, the bonding agent is filled in a shorter time.