An I.C. chip carrier and header assembly is provided. The assembly comprises a generally rectangular shrouded header with pins force fit therein. The pins are connectable to conductive traces on a printed circuit. A protective tape may be disposed over the header to control the locations at which conformal coatings may be applied, and thereby avoid extensive cleaning operations. The assembly further comprises a carrier with receptacles for receiving box-type double female carrier terminals. The I.C. chip is mountable in the carrier with the leads thereof being connectable to the carrier terminals by soldering. A cover is locked into engagement with the carrier to define a plugable subassembly. The subassembly is then urged into lockable but removable engagement with the header and the pins thereof.