发明授权
- 专利标题: Silicon semiconductor substrate with an insulating layer embedded therein and method for forming the same
- 专利标题(中): 其中嵌有绝缘层的硅半导体衬底及其形成方法
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申请号: US84209申请日: 1987-08-12
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公开(公告)号: US4837186A公开(公告)日: 1989-06-06
- 发明人: Yu Ohata , Tsuyoshi Kuramoto , Masaru Shimbo
- 申请人: Yu Ohata , Tsuyoshi Kuramoto , Masaru Shimbo
- 申请人地址: JPX Kawasaki
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JPX Kawasaki
- 优先权: JPX59-181817 19840831
- 主分类号: H01L21/18
- IPC分类号: H01L21/18 ; H01L21/762 ; H01L27/06 ; H01L27/088
摘要:
A silicon semiconductor substrate includes an insulating layer embedded therein. The silicon semiconductor substrate comprises a first silicon plate, an insulating layer embedded in the first silicon plate so that the surfaces of the silicon plate and the insulating layer are in a mirror surface, and a second silicon plate united with the first silicon plate and the insulating layer at the mirror surface of the first silicon plate and the insulating layer. The insulating layer is used for forming an isolated region in the second silicon plate.
公开/授权文献
- USD416628S Window component extrusion 公开/授权日:1999-11-16
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