Invention Grant
- Patent Title: Reflow soldering apparatus
- Patent Title (中): 回流焊接装置
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Application No.: US902635Application Date: 1986-09-02
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Publication No.: US4847465APublication Date: 1989-07-11
- Inventor: Toshio Toyama , Kazuya Kato , Tadamasa Tanaka , Masashi Yajima , Harutaka Hayasaka , Toru Arai , Hitoshi Terada
- Applicant: Toshio Toyama , Kazuya Kato , Tadamasa Tanaka , Masashi Yajima , Harutaka Hayasaka , Toru Arai , Hitoshi Terada
- Applicant Address: JPX Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JPX Tokyo
- Priority: JPX60-226375 19851011
- Main IPC: H05K3/34
- IPC: H05K3/34 ; B23K1/012 ; B23K3/04
Abstract:
A reflow soldering apparatus for soldering parts which are temporarily fixed on a substrate by using cream solder. The apparatus includes a hot gas blower provided with a number of holes for blowing hot gas through the holes. The apparatus also includes a substrate moving mechanism for moving the substrate along the hot gas blower at a distance therefrom to expose the substrate to hot gas blown through the holes, thereby reflowing the cream solder.
Public/Granted literature
- US5845551A Pliers with two plier arms Public/Granted day:1998-12-08
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