Invention Grant
- Patent Title: Connecting mechanism for electronic circuit board blanks
- Patent Title (中): 电子电路板毛坯连接机构
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Application No.: US184364Application Date: 1988-04-21
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Publication No.: US4851964APublication Date: 1989-07-25
- Inventor: Kiyoshi Endo
- Applicant: Kiyoshi Endo
- Applicant Address: JPX Tokyo
- Assignee: Terumo Kabushiki Kaisha
- Current Assignee: Terumo Kabushiki Kaisha
- Current Assignee Address: JPX Tokyo
- Priority: JPX62-60142[U] 19870421
- Main IPC: G01K7/00
- IPC: G01K7/00 ; A61B5/00 ; H05K1/02 ; H05K3/00
Abstract:
A succession of electronic circuit board blanks contoured in a board blank strip support electronic parts such as microcomputers and other components thereon and are joined at spaced intervals by narrow joints such as ribs which are spaced considerably apart from the microcomputers which are highly susceptible to stresses. When the board blanks are severed from each other by cutting off the joints, no substantial stresses will be applied to the microcomputers on the board blanks. The board blanks can easily be separated automatically into electronic circuit boards successively.
Public/Granted literature
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