发明授权
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US93524申请日： 1987-09-04
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公开(公告)号： US4857989A公开(公告)日： 1989-08-15
- 发明人: Ryuichiro Mori , Katsuyuki Fukudome , Toshinobu Banjo
- 申请人： Ryuichiro Mori , Katsuyuki Fukudome , Toshinobu Banjo
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX61-210317 19860904; JPX61-212090 19860908
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A semiconductor element mounting member which is a mounting portion of a lead frame is provided with a concave portion having a smaller area than that of the lower surface of a semiconductor element, the area being less than 4.times.4 mm.sup.2. The concave portion is filled with a bonding material, and the semiconductor element and the semiconductor element mounting member are bonded by the bonding material.
公开/授权文献
- US6144928A Method and device for determining vehicular mass 公开/授权日：2000-11-07
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