发明授权
- 专利标题: Electronic device packaging structure
- 专利标题(中): 电子器件封装结构
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申请号: US302167申请日: 1989-01-25
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公开(公告)号: US4883429A公开(公告)日: 1989-11-28
- 发明人: Takao Suzuki , Kouzou Uekido
- 申请人: Takao Suzuki , Kouzou Uekido
- 申请人地址: JPX Tokyo JPX Tokyo
- 专利权人: Japan Aviation Electronics Industry, Limited,NEC Corporation
- 当前专利权人: Japan Aviation Electronics Industry, Limited,NEC Corporation
- 当前专利权人地址: JPX Tokyo JPX Tokyo
- 优先权: JPX63-13389[U] 19880203
- 主分类号: G06F1/18
- IPC分类号: G06F1/18 ; H05K7/14
摘要:
An electronic device packaging structure, in which a plurality of electronic circuit packages are arrayed on one side of a back panel with their signal input/output terminals projecting out onto the other side of the panel and each connected to one end of one of plural wiring cables. The other ends of the wiring cables are connected to relay connectors, which are fixed to a common frame, constituting a back panel system. A pair of such back panel systems are detachably coupled together via the relay connectors.
公开/授权文献
- US5650724A Magnetic-resonance imaging apparatus 公开/授权日:1997-07-22
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