发明授权
- 专利标题: Heat resisting low expansion zirconyl phosphate-zircon composite
- 专利标题(中): 耐热低膨胀型磷酸锆锆石复合材料
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申请号: US94743申请日: 1987-09-09
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公开(公告)号: US4883781A公开(公告)日: 1989-11-28
- 发明人: Keiichiro Watanabe , Tsuneaki Ohashi
- 申请人: Keiichiro Watanabe , Tsuneaki Ohashi
- 申请人地址: JPX Nagoya
- 专利权人: NGK Insulators, Ltd.
- 当前专利权人: NGK Insulators, Ltd.
- 当前专利权人地址: JPX Nagoya
- 优先权: JPX61-215010 19860913; JPX62-129873 19870528; JPX62-129874 19870528
- 主分类号: C04B35/447
- IPC分类号: C04B35/447 ; C04B35/48
摘要:
Heat resisting low expansion zirconyl phosphate-zircon composite bodies are disclosed, which contain zirconyl phosphate and zircon as a main crystalline phase and a secondary crystalline phase, respectively. The heat resisting low expansion zirconyl phosphate-zircon composite bodies have a coefficient of thermal expansion in a temperature range from room temperature to 1,400.degree. C. being not more than 30.times.10-7/.degree. C. and a melting point being not less than 1,600.degree. C. The composite bodies have a chemical composition essentially consisting of 58.2 to 65.4% by weight of ZrO.sub.2, 17.4 to 37.1% by weight of P.sub.2 O.sub.5, and 1.5 to 19.0% by weight of SiO.sub.2. The heat resisting low expansion zirconyl phosphate-zircon composite bodies optionally contain MgO and Al.sub.2 O.sub.3 in a total amount of not more than 2.5% by weight or 0.1 to 4% by weight of Nb.sub.2 O.sub.5. A process for producing such zirconyl phosphate-zircon composite bodies is also disclosed.
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