发明授权
US4900580A Process for the electrostatic lacquering of printed circuit boards 失效
印刷电路板静电涂漆工艺

Process for the electrostatic lacquering of printed circuit boards
摘要:
A process for the electrostatic lacquering of printed circuit boards formed with continuous holes as soldering places for connecting wires. The characterizing feature of the process is that the printed circuit boards, continuously conveyed in a suspended position, are lacquered on one side, then turned over, lacquered on the other side, and the two layers of lacquer are then immediately dried simultaneously. An apparatus for the electrostatic lacquering of printed circuit boards is also disclosed.
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