发明授权
- 专利标题： Lead frame and electronic divice
- 专利标题（中）： 引线框架和电子分配
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申请号： US286849申请日： 1988-12-20
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公开(公告)号： US4907129A公开(公告)日： 1990-03-06
- 发明人: Ichio Shimizu
- 申请人： Ichio Shimizu
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX59-152884 19840725
- 主分类号： H01L23/50
- IPC分类号： H01L23/50 ; H01F3/00 ; H01F7/16 ; H01L21/60 ; H01L23/495
摘要：
A lead frame and an electronic device incorporating the lead frame wherein the lead frame includes a chip support and a plurality of leads arranged around the chip support with each of the plurality of leads having one end disposed proximate to the chip support. The one end of at least one of the plurality of leads includes a first lead portion extending in a direction toward the chip support and a second lead portion contiguous with the first lead portion. The second lead portion extends in a direction away from the chip support so that the one of the lead has a bent shape.
公开/授权文献
- US5450739A Needle curver with automatic feed 公开/授权日：1995-09-19
信息查询
IPC分类:
