Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability.The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives.The polyimide has recurring units of the following formula ##STR1## wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage.The polyimide of this invention is prepared by reacting 4,4'-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V): ##STR2## and successively imidizing the resultant polyamic acid. Examples of the ether diamine used for preparing the polyamide include,2,2-bis[4-(3-aminophenoxy)phenyl]propane,2,2-bis[4-(4-aminophenoxy)phenyl]propane,2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,4,4'-bis(3-aminophenoxy)biphenyl,4,4'-bis(4-aminophenoxy)biphenyl,bis[4-(3-aminophenoxy)phenyl] ketone,bis[4-(4-aminophenoxy)phenyl] ketone,bis[4-(3-aminophenoxy)phenyl] sulfide,bis[4-(4-aminophenoxy)phenyl] sulfide,bis[4-(3-aminophenoxy)phenyl] sulfone andbis[4-(4-aminophenoxy)phenyl] sulfone.