In a mounting structure of an acoustic component for mounting the acoustic component to a casing of an electronic equipment, the acoustic component is fitted in a cylindrical hole of a spacer that is formed of a resilient material. The spacer is fitted in a cylindrical hole of a mounting part which fits in or forms part of a casing of the electronic equipment. The spacer and the mounting part have a sound path aperture for allowing the passage of sound into and out of the casing. The mounting part is provided with a sound path groove along its outer surface for communicating with the sound path aperture of the mounting part. Because of the sound path groove, an accidental placement of an obstacle, such as a finger, cannot block the passage of the sound into or out of the sound path aperture.