发明授权
US4918513A Socket for an integrated circuit chip carrier and method for packaging
an integrated circuit chip
失效
用于集成电路芯片载体的插座和用于封装集成电路芯片的方法
- 专利标题： Socket for an integrated circuit chip carrier and method for packaging an integrated circuit chip
- 专利标题（中）： 用于集成电路芯片载体的插座和用于封装集成电路芯片的方法
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申请号： US201978申请日： 1988-06-03
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公开(公告)号： US4918513A公开(公告)日： 1990-04-17
- 发明人: Mitsukazu Kurose , Masahiro Minowa
- 申请人： Mitsukazu Kurose , Masahiro Minowa
- 申请人地址： JPX Tokyo
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX62-140973 19870605; JPX62-140976 19870605; JPX62-245536 19870929; JPX62-247470 19870930
- 主分类号： H01L21/673
- IPC分类号： H01L21/673
摘要：
An IC chip socket for receiving an IC bare chip carrier includes a guide member for guiding the periphery of the IC chip carrier. The guide member supports a plurality of connector pins having one end projecting within the guide member and another end projecting without the guide member. The connector pins electrically connect the electrodes of the chip carrier to the electronic circuit substrate. The respective ends of the connector pins projecting within the guide member are brought into contact with the electrodes of the IC chip carrier. The ends of the connector pins which project without the guide member are connectable with the electrodes mounted on the surface of the electronic circuit substrate.
公开/授权文献
- US5549939A Ornamental device for metal structure 公开/授权日：1996-08-27
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