发明授权
- 专利标题: High density connector
- 专利标题(中): 高密度连接器
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申请号: US357832申请日: 1989-05-30
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公开(公告)号: US4929197A公开(公告)日: 1990-05-29
- 发明人: Robert E. Finney
- 申请人: Robert E. Finney
- 申请人地址: NY New York
- 专利权人: ITT Corporation
- 当前专利权人: ITT Corporation
- 当前专利权人地址: NY New York
- 主分类号: H01R13/11
- IPC分类号: H01R13/11 ; H01R13/02 ; H01R13/502 ; H01R43/00 ; H01R43/20
摘要:
A connector is provided which enables close spacing of socket contacts in a highly reliable manner. The connector includes contact assemblies that each have at least two sheet metal contacts (26, 28 in FIG. 2) lying in parallel planes and a dielectric support (54) molded to the rearward portions of the contacts and to wire conductors (50, 52) connected thereto. The dielectic support includes a spacer portion (56) with a pair of arms (60, 62) separating the forward or mating ends of the socket contacts. The spacer arms are initially molded so they diverge from living hinges (66, 68) connecting them to the rearward portion of the support, the arms being pivotal together and having latches that hold them together at positions between the contacts. One of the arms includes a projection or retainer (106) that holds the contact assembly in a connector frame.
公开/授权文献
- US5527973A Purification of 1,3-propanediol 公开/授权日:1996-06-18
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