A method and apparatus for bonding two tubes in a refrigeration sealed system by soldering. The apparatus includes a pair of jaws which are spring biased in the closed position and a pair of handles for opening the jaws against the spring bias force. The jaws include electrodes having arcuate recesses therein which are arranged in opposed facing aligned relationship so that a pair of tubes may be held between the electrodes. One of the pair of tubers to which the method is applied has a flared end with a larger diameter than the other tube. The ends of the tubes are first cleaned by mechanical means and flux is then applied to the end of the smaller tube. The end of the smaller tube is then slid into the flared end of the other tube in telescoping registry and the telescoped ends are clamped between the electrodes. A solder ring is then positioned around the smaller tube into abutting relationship with the flared end of the other tube. Electric current is supplied to the electrodes to heat the telescoped tube ends so that the flux will melt and cause it to further clean the tube ends. The heat will also melt the solder which is then drawn into the interface area between the telescoped tube ends.