发明授权
US4942108A Process of making diazoquinone sensitized polyamic acid based
photoresist compositions having reduced dissolution rates in alkaline
developers
失效
制备在碱性显影剂中具有降低的溶解速率的重氮醌敏化聚酰胺酸基光致抗蚀剂组合物的方法
- 专利标题： Process of making diazoquinone sensitized polyamic acid based photoresist compositions having reduced dissolution rates in alkaline developers
- 专利标题（中）： 制备在碱性显影剂中具有降低的溶解速率的重氮醌敏化聚酰胺酸基光致抗蚀剂组合物的方法
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申请号： US404700申请日： 1989-09-08
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公开(公告)号： US4942108A公开(公告)日： 1990-07-17
- 发明人: Wayne M. Moreau , Kaolin N. Chiong , Ming-Fea Chow , Nancy W. Snyder
- 申请人： Wayne M. Moreau , Kaolin N. Chiong , Ming-Fea Chow , Nancy W. Snyder
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： G03F7/023
- IPC分类号： G03F7/023
摘要：
The dissolution rate in alkaline developer solutions of image-wise exposed photoresist systems based on diazoquinone sensitized polyamic acid is reduced to prepare relief images of fine line resolution by reducing the acidity of the polyamic acid prior to exposure.
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