Copper alloys for electrical and electronic parts and its manufacturing process are disclosed. The copper alloys consist essentially of 20 to 27% Zinc, 2 to 5% Aluminum, 0.5 to 5.0% Nickel, 0.1 to 1% Silicon, and 0.01 to 0.5% Zirconium. The copper alloys are produced by hot and cold rolling, followed by a stress relief heat treatment. The copper alloys of the initial invention exhibit high strength with good spring characteristics and are advantageously used for electric and electronic parts such as connectors, springs, relays, contacts and switches.