发明授权
US4960852A Thermosetting resin compostion from bis, maleimide and bis (meta-amino phenoxy) compound 失效
来自双,马来酰亚胺和双(间 - 氨基苯氧基)化合物的热固性树脂组合物

Thermosetting resin compostion from bis, maleimide and bis (meta-amino
phenoxy) compound
摘要:
Thermosetting resin compositions are provided which comprise aromatic bismaleimide derivatives, for example, 2,2-bis[4(3-maleimidephenoxy)phenyl]propane and diamine derivatives, for example, 4,4'-bis(3-aminophenoxy)biphenyl. Prepolymers are also prepared by conducting heat-treatment of said compositions. The compositions of this invention are used for thermoforming such as compression molding etc. as well as raw materials of adhesives and coatings. The compositions provide molded articles which are excellent, for example, impact strength, flexibility and high-temperature stability.
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