The invention provides package inspection systems which are capable of high speed sensing and evaluation of package integrity as packages are continuously conveyed in the manufacturing process. The systems are capable of measuring predetermined parameters of packages, e.g. cigarette packages, comparing the measured parameters with predetermined values, evaluating from the measured parameters the integrity of the packages and determining whether such packages are acceptable or, alternatively, should be rejected. The system can additionally obtain and store data on sensed package parameters for evaluating long-term and short-term manufacturing trends. In various embodiments of the invention, the system can inspect a single or plural package side(s), employing a single or plural line scan or area array camera(s) and may employ special optics to enable plural package side images to be obtained using a single camera. The invention also provides improved conveying systems for package inspection and master part detect systems which can be employed to obviate the need for synchronization between the inspection system and the conveying system.