发明授权
- 专利标题： Thermosetting epoxy resin composition
- 专利标题（中）： 热固性环氧树脂组合物
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申请号： US385699申请日： 1989-07-27
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公开(公告)号： US4985530A公开(公告)日： 1991-01-15
- 发明人: Shinkichi Murakami , Osamu Watanabe , Sadahisa Wada , Hiroshi Inoue
- 申请人： Shinkichi Murakami , Osamu Watanabe , Sadahisa Wada , Hiroshi Inoue
- 申请人地址： JPX
- 专利权人： Tonen Corporation
- 当前专利权人： Tonen Corporation
- 当前专利权人地址： JPX
- 主分类号： C08G59/24
- IPC分类号： C08G59/24 ; C08G59/40 ; C08G59/50
摘要：
A new thermosetting resin composition is disclosed which comprises a Bisphenol A-type epoxy resin having a number average molecular weight of smaller than 650 but not smaller than 450 and a ratio of the weight average molecular weight thereof to the number average molecular weight thereof of in the range of 1.3-3.0; and a curing agent capable of cross-linking the epoxy resin. The curing agent is preferably a compound represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attractive group; R is a lower alkyl; and m and n each is an integer of 1-4, or a mixture thereof with a primary amine, a phenolic compound or an acid anhydride.