发明授权
- 专利标题： Semiconductor module and cooling device of the same
- 专利标题（中）： 半导体模块和冷却装置相同
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申请号： US258609申请日： 1988-10-17
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公开(公告)号： US4996589A公开(公告)日： 1991-02-26
- 发明人: Ryoichi Kajiwara , Takao Funamoto , Mituo Kato , Hiroshi Wachi , Tomohiko Shida
- 申请人： Ryoichi Kajiwara , Takao Funamoto , Mituo Kato , Hiroshi Wachi , Tomohiko Shida
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX62-263856 19871021; JPX62-283318 19871111; JPX63-67436 19880323
- 主分类号： H01L23/433
- IPC分类号： H01L23/433
摘要：
A number of LSI chips (9) are mounted on a wiring substrate (12). A cooling element (68) comprises a housing (1), a bellows (2) and a cooling plate (6) for introducing a cooling medium. The cooling element is connected to the LSI chip by low melting solder, at the same time, the cooling plate is connected to the wiring substrate through a skirt (5) which is connected to the cooling plate and also connected to the wiring substrate by a low melting solder.
公开/授权文献
- US5493144A Field progammable device with contact openings 公开/授权日：1996-02-20
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