A spray manifold for spraying liquid chemicals, suspension and solutions upon workpieces such as printed circuit boards. The spray manifold comprises a tubular pheriphery with a plurality of tubular inner members disposed therein and fluidly connected thereto. Spray nozzles mounted at various points on the manifold provide for emanation at a desired spray pattern from the manifold. The configuration and interconnection of the various tubular components of the manifold is specifically arranged and designed to prevent turbulence of fluid flowing therewithin and to promote even and continuous fluid pressure throughout the manifold.