A chip-type coil whose terminal electrodes are formed directly on a magnetic core and each comprise a mixture of electrically conductive material with insulating material, so that specific resistance of the terminal electrode can increase so as to reduce an eddy current flowing in the terminal electrode, thereby preventing Q-deterioration in the chip-type coil. Moreover, the chip-type coil is allowable of Q-deterioration caused by metal plating, thereby enabling the terminal electrodes to be applied with metal plating.