To reduce thermal stress produced at soldering process of a connector with built-in through capacitors having a resin connector housing, connector pins passed through the resin connector housing, a metallic shield casing for covering the resin connector housing, and through capacitors formed between the connector pins and the metallic shield casing, respectively, the metallic shield casing is formed in particular with roughly U-shaped cross section deformable projections or divided into at least two parts having a slidably overlapped joint end portion, respectively.