A device for aiding in the assembly of a mold apparatus of the type including a mold cavity having a first side which is contoured to impart a shape to a component, a second side, and an aperture extending between the first and second sides, and of the type including an ejector pin positioned adjacent the second side, the ejector pin having an end positioned to move into the aperture to become a portion of a surface including the first side when the mold assembly is assembled, and positioned to effect movement of the component away from the mold cavity after the component is imparted with the shape, the device including an assembly pin having an end positioned to pass through the aperture, and a sleeve having a first portion positioned to slide onto the end of one of the ejector pins and to support itself on the end of the ejector pin and having a second portion protruding from the end of the ejector pin to receive therein the end of the assembly pin in axial alignment with the ejector pin in the sleeve.