Invention Grant
- Patent Title: Engineering plastic composition and an article made of the same
- Patent Title (中): 工程塑料成分与制品相同
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Application No.: US356725Application Date: 1989-05-25
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Publication No.: US5011879APublication Date: 1991-04-30
- Inventor: Toshio Uesaka , Akihiro Niki , Makoto Ohsuga , Toranosuke Saito , Hiroki Tsunomachi , Makoto Yamaguchi , Kazuo Doyama , Daishiro Kishimoto
- Applicant: Toshio Uesaka , Akihiro Niki , Makoto Ohsuga , Toranosuke Saito , Hiroki Tsunomachi , Makoto Yamaguchi , Kazuo Doyama , Daishiro Kishimoto
- Applicant Address: JPX Osaka JPX Osaka
- Assignee: Sekisui Kagaku Kogyo Kabushiki Kaisha,Kabushiki Kaisha Sanko Kaihatsu Kagaku Kenkyusho
- Current Assignee: Sekisui Kagaku Kogyo Kabushiki Kaisha,Kabushiki Kaisha Sanko Kaihatsu Kagaku Kenkyusho
- Current Assignee Address: JPX Osaka JPX Osaka
- Priority: JPX63-129174 19880526; JPX63-129175 19880526; JPX63-129176 19880526; JPX63-129177 19880526; JPX63-216873 19880831; JPX63-216875 19880831; JPX63-304605 19881130; JPX63-304606 19881130; JPX63-304607 19881130; JPX63-304608 19881130; JPX1-15682 19890125
- Main IPC: C08K5/01
- IPC: C08K5/01 ; C08K5/06 ; C08K5/101 ; C08K5/13
Abstract:
An engineering plastic composition with excellent flowability, heat stability, and desirable mechanical properties is provided. The composition comprises an engineering plastic material and at least one p-quaterphenyl derivative of specific formula.
Public/Granted literature
- US5696729A Power reducing circuit for synchronous semiconductor device Public/Granted day:1997-12-09
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