发明授权
- 专利标题： Bonding method
- 专利标题（中）： 粘合方法
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申请号： US474213申请日： 1990-02-01
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公开(公告)号： US5020715A公开(公告)日： 1991-06-04
- 发明人: Kazumasa Kimura , Akira Komamiya , Takashi Endo
- 申请人： Kazumasa Kimura , Akira Komamiya , Takashi Endo
- 申请人地址： JPX Tokyo
- 专利权人： Kabushiki Kaisha Shinkawa
- 当前专利权人： Kabushiki Kaisha Shinkawa
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX62-325726 19871223
- 主分类号： H01L21/52
- IPC分类号： H01L21/52 ; H01L21/00 ; H01L21/60
摘要：
A bonding method including the steps of dividing a substrate into a plurality of regions along its length, storing substrate feeding data and bonding pattern data for the respective regions into a data memory, feeding the substrate underneath a bonding tool in accordance with the substrate feeding data, and then successively performing bonding for the respective regions in accordance with the bonding pattern data.
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