发明授权
US5032674A Polyarylene sulfide molding compounds and their use as an encapsulating compound for active and passive electronic components 失效
聚芳硫醚模塑料及其作为活性和无源电子元件封装化合物的用途

Polyarylene sulfide molding compounds and their use as an encapsulating
compound for active and passive electronic components
摘要:
The invention relates to molding compounds of polyarylene sulfides (PAS), preferably polyphenylene sulfides (PPS), which have a low ion content and delayed crystallization and to their use as an encapsulating compound for active and passive electronic components.
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