发明授权
- 专利标题： Lead frame and semiconductor device using the same
- 专利标题（中）： 引线框和半导体器件使用相同
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申请号： US518410申请日： 1990-05-02
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公开(公告)号： US5041901A公开(公告)日： 1991-08-20
- 发明人: Makoto Kitano , Asao Nishimura , Akihiro Yaguchi , Sueo Kawai , Akio Hoshi , Ichio Shimizu
- 申请人： Makoto Kitano , Asao Nishimura , Akihiro Yaguchi , Sueo Kawai , Akio Hoshi , Ichio Shimizu
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX1-114953 19890510
- 主分类号： H01L23/50
- IPC分类号： H01L23/50 ; H01L23/495 ; H05K3/34
摘要：
A lead frame having a plurality of inner leads and outer leads, said outer leads being subjected to surface treatment for improving solder wettability at an end portion and to sruface treatment for suppressing solder wettability at least at a portion neighboring to the end portion, or said outer leads being bent 4 times or more, is effective for improving thermal fatigue life and reliability when applied to a semi-conductor device.
公开/授权文献
- US5577629A Package box 公开/授权日：1996-11-26