利索-全球专利检索

  1. 登录
  2. 注册
发明授权
US5045919A Plastic packaged semiconductor device having bonding wires which are prevented from coming into contact with each other in plastic sealing step 失效
塑料封装半导体器件具有在塑料密封步骤中防止彼此接触的接合线

  • 专利标题： Plastic packaged semiconductor device having bonding wires which are prevented from coming into contact with each other in plastic sealing step
  • 专利标题（中）： 塑料封装半导体器件具有在塑料密封步骤中防止彼此接触的接合线
  • 申请号： US579664
    申请日： 1990-09-10
  • 公开(公告)号： US5045919A
    公开(公告)日： 1991-09-03
  • 发明人: Tetsuya Nagaoka
  • 申请人： Tetsuya Nagaoka
  • 申请人地址： JPX Kawasaki
  • 专利权人： Kabushiki Kaisha Toshiba
  • 当前专利权人： Kabushiki Kaisha Toshiba
  • 当前专利权人地址： JPX Kawasaki
  • 优先权： JPX1-236408 19890912
  • 主分类号： H01L21/60
  • IPC分类号： H01L21/60 ;  H01L23/485 ;  H01L23/495
Plastic packaged semiconductor device having bonding wires which are prevented from coming into contact with each other in plastic sealing step
摘要：
Bonding pads for deriving out electrodes of semiconductor elements formed on a pellet to the exterior are formed on the pellet. The pellet is mounted on a bed. Inner lead portions of a lead frame are arranged on the surrounding portion of the bed to extend radially away from the bed. A distance between those of the inner lead portions which are disposed in position corresponding to the corner portion of the bed is set larger than a distance between those of the inner lead portions which are disposed in the other position. The bonding pads are electrically connected to the inner lead portions by means of bonding wires. The pellet, bed, inner lead portions and bonding wires are sealed into a plastic package.
摘要（中）：

在颗粒（11）上形成用于将形成在颗粒（11）上的半导体元件的电极导出到外部的接合焊盘（12）。 颗粒（11）安装在床（13）上。 引线框架的内引线部分（14）布置在床（13）的周围部分上以径向远离床（13）延伸。 设置在与床（13）的角部相对应的位置的内引线部（14）之间的距离（DELTA W1）被设定为大于内引线部的距离（DELTA W2） 14）设置在另一位置。 接合焊盘（12）通过接合线（16）与内引线部分（14）电连接。 颗粒（11），床（13），内引线部分（14）和接合线（16）被密封成塑料封装。

公开/授权文献
信息查询
Global Dossier Espacenet
0/0