A method of attaching a gripping device to a packaging laminate involves forming a recess in a packaging laminate that extends only a part of the way through the thickness of the packaging laminate. Molten plastic material is injected into the recess to cause the molten plastic material to become partly united with plastic layers that cover the central carrier layer of the laminate, thereby forming an anchorage device in the laminate. The gripping device can be attached to the anchorage device after the injection molding process or simultaneously during the injection molding process.