- 专利标题: Thermoplastic resin composition
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申请号: US310903申请日: 1989-02-16
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公开(公告)号: US5049613A公开(公告)日: 1991-09-17
- 发明人: Sachio Shimizu , Tetsuji Miura , Toshio Noda , Hiroshi Murakami
- 申请人: Sachio Shimizu , Tetsuji Miura , Toshio Noda , Hiroshi Murakami
- 申请人地址: JPX Tokyo
- 专利权人: Denki Kagaku Kogyo Kabushiki Kaisha
- 当前专利权人: Denki Kagaku Kogyo Kabushiki Kaisha
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX63-41015 19880224; JPX63-283720 19881111
- 主分类号: C08L77/00
- IPC分类号: C08L77/00
摘要:
A thermoplastic resin composition comprising:(A) from 10 to 50% by weight of a maleimide copolymer of from 30 to 70 mol % of an aromatic vinyl monomer, from 30 to 50 mol % of a maleimide monomer, from 3 to 20 mol % of an unsaturated dicarboxylic anhydride monomer and from 0 to 50 mol % of other copolymerizable monomer;(B) from 40 to 80% by weight of a polyamide; and(C) from 3 to 40% by weight of a polyolefin polymer modified by from 0.1 to 10% by weight of an unsaturated dicarboxylic anhydride monomer and/or an unsaturated carboxylic acid monomer,wherein said maleimide copolymer is in the form of dispersed particles of from 0.01 to 1.0 .mu.m.
公开/授权文献
- US5571187A Implant having a metallic porous surface 公开/授权日:1996-11-05
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