发明授权
- 专利标题： LSI temperature control system
- 专利标题（中）： LSI温控系统
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申请号： US382203申请日： 1989-07-19
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公开(公告)号： US5052472A公开(公告)日： 1991-10-01
- 发明人: Kenji Takahashi , Takuji Torii , Takao Senshu , Tetsuji Yamashita , Shizuo Zushi
- 申请人： Kenji Takahashi , Takuji Torii , Takao Senshu , Tetsuji Yamashita , Shizuo Zushi
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 主分类号： F25B13/00
- IPC分类号： F25B13/00 ; F25B25/00 ; F25B41/06 ; F25B49/02 ; F25D17/02 ; H01L23/473
摘要：
An LSI temperature controlling system has closed LSI cooling water circuit, and a refrigeration circuit including a motor-driven refrigerant compressor, a first heat exchanger for exchanging the heat of the LSI cooling water and the refrigerant and a second heat exchanger for exchanging the heats of the refrigerant and another fluid. The motor speed is controlled by an inverter the operation of which is controlled based on the temperature of the LSI cooling water measured by a temperature detector. A heater is used to suppress dew formation on LSI substrates.
公开/授权文献
- US5615592A Leather cutting apparatus 公开/授权日：1997-04-01
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