A mold clamping apparatus is provided, including upper and lower toggle sections disposed symmetrically with respect to an axis of the apparatus, each toggle section including a ball screw disposed radially outwardly of the apparatus with respect to the axis, a head threadedly engaged therewith, and links operable to expand and bend with reciprocal head motion along the ball screw, each ball screw being directly coupled to a corresponding one of two servomotors connected to a control circuit section including a pulse width modulation control circuit and two transistor inverters. The mold clamping apparatus has primarily structural components separated from the axis so that flexure of the toggle mechanisms and resultant non-uniformity of a pressing force onto the movable platen are eliminated, and each servomotor is small enough to drive a corresponding one toggle section, so that the resultant mold clamp apparatus is low in cost and high in operational response.