Invention Grant
- Patent Title: Cut and score die apparatus and method
- Patent Title (中): 切割和分数模具设备和方法
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Application No.: US475816Application Date: 1990-02-06
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Publication No.: US5052992APublication Date: 1991-10-01
- Inventor: L. Edward Hyder
- Applicant: L. Edward Hyder
- Applicant Address: IN Marion
- Assignee: Peerless Machine & Tool Corporation
- Current Assignee: Peerless Machine & Tool Corporation
- Current Assignee Address: IN Marion
- Main IPC: B31B45/00
- IPC: B31B45/00
Abstract:
A cut and score die apparatus is provided for progressively converting a sheet of material into blanks. The apparatus includes a punching section for punching scrap material from the sheet of material to define an array of interconnected blanks arranged in a grid of rows and columns on the sheet of material. A scoring section is provided for simultaneously scoring a first predetermined pattern on a trailing portion of a first row of blanks and a second predetermined pattern on the leading portion of a second, succeeding row of blanks on the sheet of material. A blanking section is also provided for piercing the sheet of material in a predetermined pattern to cut blanks from the sheet of material without producing any additional scrap material.
Public/Granted literature
- US5644565A Optical recording medium including a plurality of diffracted grating cells Public/Granted day:1997-07-01
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