Invention Grant
US5059242A Seed layer compositions containing organogold and organosilver compounds
失效
含有机金属和有机金属化合物的种子层组合物
- Patent Title: Seed layer compositions containing organogold and organosilver compounds
- Patent Title (中): 含有机金属和有机金属化合物的种子层组合物
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Application No.: US516080Application Date: 1990-04-27
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Publication No.: US5059242APublication Date: 1991-10-22
- Inventor: Michael G. Firmstone , Andrew Lindley
- Applicant: Michael G. Firmstone , Andrew Lindley
- Assignee: Firmstone Michael G,Andrew Lindley
- Current Assignee: Firmstone Michael G,Andrew Lindley
- Main IPC: C23C18/08
- IPC: C23C18/08 ; H05K3/24
Abstract:
A fluid composition for producing a gold seed layer on a substrate for an electrical circuit, which comprises an organogold and an organosliver compound present as 0.5 to 10 parts by weight silver per 100 parts by weight gold. In preferred compositions the silver is present as 0.8 to 6 parts by weight per 100 parts gold. The process improves seed layer to substrate adhesion.
Public/Granted literature
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