发明授权
- 专利标题： Method for forming tough, electrical insulating layer on surface of copper material
- 专利标题（中）： 在铜材表面形成电镀绝缘层的方法
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申请号： US652503申请日： 1991-02-08
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公开(公告)号： US5078844A公开(公告)日： 1992-01-07
- 发明人: Kunio Katsuma
- 申请人： Kunio Katsuma
- 专利权人： Kunio Katsuma
- 当前专利权人： Kunio Katsuma
- 优先权： JPX2-36346 19900219
- 主分类号： C25D11/34
- IPC分类号： C25D11/34 ; H01B3/10
摘要：
An electrical insulating coating layer having excellent adhesion, toughness and heat resistance is formed on a surface of a copper material by anodizing the copper material under a low current in an acid bath of a hexacyanoiron complex. Copper materials such as coil wires can hence be provided with a thin, heat-resistant, electrical insulating layer, whereby the values of the copper materials can be heightened.
公开/授权文献
- US5993214A Method for manufacture of a dental product 公开/授权日：1999-11-30
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