Invention Grant
- Patent Title: Vibration-proof tungsten wire
- Patent Title (中): 防振钨丝
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Application No.: US557715Application Date: 1990-07-25
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Publication No.: US5087299APublication Date: 1992-02-11
- Inventor: Mikiharu Fukuchi , Yasuhiko Nakano , Keisuke Hayashi , Isamu Koseki , Masami Ito , Ryozo Akiyama
- Applicant: Mikiharu Fukuchi , Yasuhiko Nakano , Keisuke Hayashi , Isamu Koseki , Masami Ito , Ryozo Akiyama
- Applicant Address: JPX Kawasaki JPX Yokohama
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Material Engineering Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Material Engineering Corporation
- Current Assignee Address: JPX Kawasaki JPX Yokohama
- Priority: JPX1-84898 19890405
- Main IPC: C22F1/18
- IPC: C22F1/18 ; B22F3/24 ; B22F5/12 ; B22F9/22 ; C22F1/00 ; H01K1/08 ; H01K3/02
Abstract:
A vibration-proof tungsten wire which forms, in cases where the diameter of the wire is D mm and when an electric current corresponding to 90% of the fusion current value is passed therethrough for 5 minutes, a wire havinga crystal grain boundary at which bubbles of 0.3 .mu.m or less in diameter are dispersed in bubble rows with lengths of (0.39/D).sup.2 .times.3 .mu.m or more arrayed in the wire axis direction of said crystal grain boundary, and bubbles of 0.2 .mu.m or less in diameter are randomly dispersed; anda crystal grain in which bubbles of 0.3 .mu.m or less in diameter are dispersed in rows with lengths of (0.39/D).sup.2 .times.30 .mu.m or more arrayed in the wire axis direction within said crystal grain, and bubbles of 0.2 .mu.m or less are randomly dispersed;a process for preparing the same; and a tungsten filament obtained from the above-defined wire. The doped tungsten wire of this invention possesses excellent vibration-proof property on lighting as well as high reliability.
Public/Granted literature
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