发明授权
US5091474A Epoxy resin curing agent based on blends containing disecondary aromatic
diamines
失效
环氧树脂固化剂基于含有异构芳族二胺的混合物
- 专利标题: Epoxy resin curing agent based on blends containing disecondary aromatic diamines
- 专利标题(中): 环氧树脂固化剂基于含有异构芳族二胺的混合物
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申请号: US642545申请日: 1991-01-18
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公开(公告)号: US5091474A公开(公告)日: 1992-02-25
- 发明人: Shinkichi Murakami , Osamu Watanabe , Sadahisa Wada , Makoto Miyazaki , Hiroshi Inoue
- 申请人: Shinkichi Murakami , Osamu Watanabe , Sadahisa Wada , Makoto Miyazaki , Hiroshi Inoue
- 申请人地址: JPX
- 专利权人: Toa Nenryo Kogyo Kabushiki Kaisha
- 当前专利权人: Toa Nenryo Kogyo Kabushiki Kaisha
- 当前专利权人地址: JPX
- 优先权: JPX63-34803 19880217; JPX63-108860 19880429
- 主分类号: C07C211/54
- IPC分类号: C07C211/54 ; C07C217/90 ; C07C225/22 ; C07C317/36 ; C07C323/37 ; C08G59/50 ; C08G59/56
摘要:
A two component-type curing agent composition is disclosed which comprises a first curing agent which is capable of cross-linking an epoxy resin and which is at least one member selected from primary amines, phenolic compounds and acid anhydrides, and a second curing agent which is at least one compounds represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attracting group; R is a lower alkyl; and m and n each is an integer of 1-4.
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