发明授权
- 专利标题： Ultrasonic array with a high density of electrical connections
- 专利标题（中）： 超声波阵列具有高密度的电气连接
-
申请号： US504750申请日： 1990-04-05
-
公开(公告)号： US5091893A公开(公告)日： 1992-02-25
- 发明人: Lowell S. Smith , Charles W. Eichelberger , Robert J. Wojnarowksi , Wiliam P. Kornrumpf , Joseph E. Piel, Jr.
- 申请人： Lowell S. Smith , Charles W. Eichelberger , Robert J. Wojnarowksi , Wiliam P. Kornrumpf , Joseph E. Piel, Jr.
- 申请人地址： NY Schenectady
- 专利权人： General Electric Company
- 当前专利权人： General Electric Company
- 当前专利权人地址： NY Schenectady
- 主分类号： B06B1/06
- IPC分类号： B06B1/06
摘要：
A piezoelectric ultrasonic array transducer has its individual elements connected to external electronics via a high density interconnect structure which facilitates signal connection and uniformity from array-to-array. The array fabrication process is preferably modified for use with a high density interconnect structure in order to obtain maximum transducer quality.
信息查询
IPC分类:
