Invention Grant
- Patent Title: High resolution thermal printing device
- Patent Title (中): 高分辨率热敏打印设备
-
Application No.: US606895Application Date: 1990-10-31
-
Publication No.: US5097271APublication Date: 1992-03-17
- Inventor: Bae-Won Lee , Jin-Ku Kang , Hong-Geun Yang
- Applicant: Bae-Won Lee , Jin-Ku Kang , Hong-Geun Yang
- Applicant Address: KRX Kyung Ki-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KRX Kyung Ki-Do
- Priority: KRX1990-6259 19900503
- Main IPC: B41J2/34
- IPC: B41J2/34 ; B41J2/345
Abstract:
There is disclosed a high resolution thermal printing device including a 128-bit uni-directional integrated circuit, which is specially ordered, instead of a general integrated circuit. The electrical connection of the device is achieved by wedge wire bonding employing wedges. The integrated circuit has a plurality of power source connecting pads which are aligned on the central portion the integrated circuit in parallel with the transverse direction thereof.
Public/Granted literature
- USPP9996P Miniature rose plant named `POULDEL` Public/Granted day:1997-08-12
Information query
IPC分类:
